The Xinduoduo AI Empowering Semiconductor Industry Integration and Scenario Implementation Forum was successfully held in Beijing.

September 8, 2026, the "AI Empowering Semiconductor Industry Integration and Scenario Implementation Forum" hosted by IBI Xinduo and co-organized by Xuzhou Semiconductor Industry Association was grandly held at Jingfeng Hotel. This forum focused on the deep integration of AI technology and the semiconductor industry, bringing together more than fifty industry experts, corporate representatives, and investment institutions to conduct in-depth discussions on cutting-edge topics such as supply chain collaboration, storage technology, intelligent manufacturing, and green computing power.

The forum was hosted by Zhou Daihua, Secretary-General of Xuzhou Semiconductor Industry Association. Opening speeches were delivered by Hao Fang, Vice President of IBI and CEO of Chip / Cultural Tourism Duoduo, and Xu Dongmei, Secretary-General of the Packaging and Testing Branch of the China Semiconductor Industry Association, warmly welcoming the guests in attendance.

In the keynote speech session, nine industry leaders took the stage one after another to share cutting-edge insights. Industry representatives included Hao Fang, Vice President of IBI and CEO of Chip / Cultural Tourism Duoduo; Xu Dongmei, a senior expert in the semiconductor packaging and testing industry; Feng Mingxian, Dean of Asia-Pacific Chip Valley Technology Research Institute; Chen Guyu, Business Director of UISEE Robotics; Liu Yang, Deputy Chief Engineer of Suzhou Company of Eleventh Technology; Gao Daopeng, Vice President of Wushi Microelectronics (Suzhou) Co., Ltd.; Fang Ying, Deputy Chief Economist of Yunnan Electric Power Technology Co., Ltd.; Qi Jianchao, Deputy General Manager of Zhongqin Microyuan; and Tian Guo, Partner of Shuimu Wutong Venture Capital. They delivered forward-looking presentations on topics such as industrial internet empowering supply chains, HBM and storage revolution, storage chip investment outlook, semiconductor factory robotics, chip design, wafer bonding, green computing power factories, electronic-grade low-resistance filtration, and optoelectronic chips. The discussions covered multiple perspectives including technology, industry, and capital, offering a wealth of valuable insights.

At the end of the forum, attendees took a group photo and engaged in in-depth networking to explore cooperation opportunities. Currently, artificial intelligence is rapidly reshaping various industries, and as the core foundational support, the coordination level of materials, storage, packaging and testing, intelligent computing, and energy-saving segments directly determines the effectiveness of industrial upgrades. This was the core focus of the forum's discussions on industry integration and scenario implementation. As a semiconductor industry internet platform under IBI, Xinduo will continue to deeply cultivate the semiconductor industry chain, leverage the value of the platform, and use digital power to connect upstream and downstream enterprises, making the supply chain more efficient and industry collaboration closer.